JPH087679Y2 - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPH087679Y2 JPH087679Y2 JP1990046830U JP4683090U JPH087679Y2 JP H087679 Y2 JPH087679 Y2 JP H087679Y2 JP 1990046830 U JP1990046830 U JP 1990046830U JP 4683090 U JP4683090 U JP 4683090U JP H087679 Y2 JPH087679 Y2 JP H087679Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- terminals
- circuit board
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 claims description 25
- 230000037431 insertion Effects 0.000 claims description 25
- 238000005476 soldering Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046830U JPH087679Y2 (ja) | 1990-05-01 | 1990-05-01 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046830U JPH087679Y2 (ja) | 1990-05-01 | 1990-05-01 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH045697U JPH045697U (en]) | 1992-01-20 |
JPH087679Y2 true JPH087679Y2 (ja) | 1996-03-04 |
Family
ID=31562245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990046830U Expired - Fee Related JPH087679Y2 (ja) | 1990-05-01 | 1990-05-01 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087679Y2 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519126U (en]) * | 1978-07-19 | 1980-02-06 | ||
JPS5587368U (en]) * | 1978-12-12 | 1980-06-16 | ||
JPH0627396B2 (ja) * | 1985-12-25 | 1994-04-13 | 越智 巌 | 輪奈付綿タオル組織と合成繊維メッシュ組織の複合織物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH075141B2 (ja) * | 1987-03-25 | 1995-01-25 | 松下電器産業株式会社 | テ−ピング用電子部品 |
JPH0238720U (en]) * | 1988-09-08 | 1990-03-15 |
-
1990
- 1990-05-01 JP JP1990046830U patent/JPH087679Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH045697U (en]) | 1992-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |